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Keywords / Skills : Pro-E, CAD, C, VB, Basic, module

5 - 8 years
Posted: 2018-12-27

Product Engineer
Posted On
27th Dec 2018
Job Ref code
Job Description

  • Support CIP (Continue Improvement Project) regarding manufacturing cost focus , assembling and test in team work with engineering
  • Define needed test/assembly jig & tools to ensure the required quality during production for CIP and running production
  • Purchase and buildup of existing test systems & equipment to ensure serial production.
  • Create and implement new test programme for module or subassembly
  • Creates and sustain the needed production documentation with production team and supplier example: Work instruction and Testinstruction
  • Supports Engineering Change Process (ECP) or Change control (CC)regarding CIP
  • Knows the DAPI process and works according the defined steps
  • Works close together with other department and supports them regardingtechnical topics and quality issues
  • To troubleshoot and resolve design or engineering related problemsfeedback from internal customers including module assembly, machineassembly, application Engineer, and others.
  • Participate in resolving design or engineering related issue found atcustomer site and travel to customer site when required.
  • Support the outsourcing of CIP design to serial supplier and supports thesupplier during the serial phase until phase-out
  • Supports global all modules and machine in serial status
  • To contribute to departmental goals, assist and support peers and superior
  • To initiate and participate in improvement activities
  • To perform other jobs as and when assigned by the superior.
JOB REQUIREMENTS(Qualification / Education / Years of experience)
  • Bachelor Degree in Engineering (Mechanical Engineering, ManufacturingEngineering, Material Engineering, Mechatronic Engineering or equivalent). (with at least 2 Class Upper Qualification for Fresh Graduates
  • 2 (or more) years working experience in product design related Semiconductor Back End Process, preferably related to Die Attach and Wire Bonding
  • Diploma (or higher) in mechanical/electronic/mechatronic engineering from reputable international or local university with more than 5 years experience in Semiconductor Back End Process related to Die Attach will be also considered.
  • Knowledge of CAD software (Pro-E, Solid Edge or other equivalent CAD software)
  • Basic knowledge of C programming or VB
  • Ability to read and interpret engineering drawings and have a goodunderstanding of geometrical dimensioning and tolerance (GD&T)
  • Ability to assemble small objects and component parts.
  • Good understanding of engineering materials, manufacturing processes,and mechanical parts & components.
  • Knowledge on problem solving tools (8D Approach Tools, SWOTAnalysis, etc)
  • Knowledge in Electrical wiring / Pneumatic System /system automation
  • Technical know-how in module and machine functionality
  • Understanding of technical contexts
  • Prefer Hands On & Troubleshooting Approach on Machines

Key Skill(s)

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