Board Design Engineer

Board Design Engineer

4-7 years
Not Specified

Job Description

Job Description :
Job Description
Intel's Tester Solutions and Tester Development Group core charter is the design and development of cutting-edge state of the art modular factory testers.
As a Test Research Board Design Engineer (aka. Hardware Design Engineer), you will be engaged in all aspects of instrument printed circuit board design and development ranging from the initial conceptual design/proto-typing phases all the way to the final high-volume instrument card production designs. Additional duties include but not limited to hardware planning, validation, debug, and sustaining activities.
The ideal candidate must exhibit the following behavior traits:
  • Work in a cross-team multi-discipline collaborative environment, show leadership within technical teams.
  • Willingness in owning projects with limited supervision balancing technical and business requirements and identifying and driving key issues to closure.
  • Tolerance of ambiguity.
  • Verbal and written communication skills are required along with the ability to proactively apply highly disciplined approaches to problem solving in a fast-pace design/development environment.
  • Design management skills including schedule estimation, status reporting, process flows, and coordinating/managing efforts across a multi-discipline engineering team.

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Minimum qualifications:
  • Candidate must possess a Bachelor with 4+ years of experience or MS degree with 3+ years of experience or PhD degree with 1+ years of experience in Electrical Engineering or related engineering and/or science disciplines.
  • 4+ years of board level design experience.
  • 1+ years of experience in design processes and proficient use of the Cadence PCB design toolset (Concept HDL/Allegro).

Preferred qualifications:
1+ years of experience In the following:
  • Translating high level architectural requirements into complex high volume production capable, PCB designs, encompassing the entire low level board design/implementation details such as Build of Materials (BOM) selection, schematic development, component parts placement, circuit board routing constraints, voltage regulator design/layout, power distribution, power budget analysis, and design for test/manufacturability principles.
  • Power delivery and signal integrity in electrical circuits.
  • High-speed Printed Circuit Boards (PCB) system designs which include Field Programmable Gate Arrays, memory, voltage regulators, and application specific integrated circuits, etc.
  • Printed Circuit Board manufacturing processes, materials, and stack-up topologies.
  • Digital design skills and knowledge of high-speed interfaces and buses such as PCIe, USB, DDR Memory, and general high-speed differential clocks.
  • Lab equipment including but not limited to: multimeters, High Speed Signal Analysis tools, logic analyzer interfaces, oscilloscopes, Network Analyzers, and use of soldering/rework equipment.
  • Hardware test plan creation, power-on, testing and troubleshooting/debug at the schematic/layout level.

Intel SPEED BOM management.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Other Locations
Malaysia, Penang

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