Package Design Engineer

Package Design Engineer

Intel
Penang Malaysia
Not Specified
Not Specified

Job Description


Job Description :
Job Description
Package Design Engineer (PDE) is responsible for the project management and the delivery of the package design tape-out. The candidate is expected to scope all the package design requirements and document these in the Package Design Requirement Document (PDRD). The candidate needs to ensure compliance which includes electrical performance meeting the requirement through the package design and delivery of the design collaterals. The PDE is responsible for leading product design from the planning phase all the way to design tape out and providing support to the stakeholders post tape-out if required.
The responsibilities include but not be limited to:
- Leading the Package Design Working Group (PDWG) to work with key internal/external partners to comprehend the detail design requirements.
- Managing the package design schedule partnering with stakeholders to ensure package tape-out per schedule.
- Good understanding of the Package/Assembly cost and leveraging design methods to lower the package cost.
- Leading the package design reviews to ensure stakeholder approval and design compliance with requirements.
- Documenting the detailed design requirements clearly in the PDRD.
- Using the CAD software to design the substrate in compliance with existing design rules, electrical requirements and processes.
- Providing route and fit studies for design tradeoff.
- Generating high quality design documents in timely manner for manufacturers and package assembly modules.
- Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.
Qualifications
The candidate must possess a Bachelor, Master or PhD degree in Electrical/Electronics or Mechanical Engineering.
Additional qualification includes but not limited to:
- Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply.
- Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor Expedition or any equivalent software will be added advantage.
- Experienced in using Electrical Design Analysis software tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice, Sigrity or any equivalent software will be added advantage.
- Good project management skills and passionate to continuously learn.
- The candidate should also have good communication (written and presentation) and problem solving skills.
- Excellent team work is an expectation.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
Other Locations
Malaysia, Kulim

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