Package Reliability Engineer

Package Reliability Engineer

Micron Semiconductor Asia Operations Pte. Ltd
Penang Malaysia
Not Specified
Not Specified

Job Description

Req. ID: 238062
As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be expected to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMA’s, and prepare reports for discussion. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.
Successful Candidates for this position will have:
  • Thorough knowledge of semiconductor component package assembly processes and challenges
  • Knowledge of surface mount processes and challenges
  • Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies
  • Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability
  • A working knowledge of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred
  • Must be self-motivated, able to work independently, and detail oriented
  • Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
  • Good written and verbal communication skills are computer skills are necessary
  • Working knowledge of the software systems employed in backend manufacturing is a plus

Qualification Requirements:
  • Minimum of BS degree, M. Sc or equivalent experience in Engineering or a related field of study.
  • Knowledge in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis, or a related field preferred.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our
Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Quality || Experienced || Regular || Engineering || #LI-EA1 ||Tier 4||

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