Packaging R&D Engineer (Senior)

Packaging R&D Engineer (Senior)

Penang Malaysia
Not Specified
Not Specified

Job Description

Job Description :
Job Description
Intel is seeking to hire a Packaging Responsible Engineer to provide package architecture, design, development and project management support for integrated circuit or semiconductor assemblies or various other electronic component. This role is responsible for leading product design from the planning phase all the way to design tape out. Defines overall package performance and specification and realizes technology certification through layout design. This include intensive work with Si and platform design teams in order to get optimized Si floorplan and bumpout that will meet best package and PCB routing.
- To be able to lead the Package Working Group to work with silicon, system and electrical team to comprehend the technical and schedule requirement.
- Using the CAD software to design the substrate in compliance with existing design rules, electrical requirements and processes.
- Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.
- You must possess a Bachelor, Master or PhD degree in Electrical/Electronics or Mechanical Engineering.
Additional qualification includes but not limited to:
- Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor Expedition or any equivalent software will be added advantage.
- Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply.
- Those with good project management skills and the passion to continuously learn.
- The applicant should also have good communication (written and presentation) and problem solving skills.Inside this Business Group
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.
Other Locations
Malaysia, Kulim

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