Job Description :
Micron’s vision is to transform how the world uses information to enrich life for all.Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
Our vision is to transform how the world uses information to enrich life. Join an inclusive team focused on one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
Do you strive in a dynamic work environment We are looking for highly motivated and dedicated individuals to join us as in our Package Development Engineering Team! Job description:
As a PDE CEM Manager, you will be responsible for building and leading a team of engineers to developadvanced packaging process solution and ensure NPI success for NAND, managed NAND and DRAM product at Micron MemoryMalaysia.Tolead new product introduction process readinessand improving the yield, quality and reliability with process characterization and optimization and new materials, machines& technologies introduction. You will need to have a deep understanding of packaging requirements, chip/package interaction, equipment capability and process technology thoroughout the industry and the ability to enable best technology for New Product Introduction assembly packaging requiremetns. You will also be required to lead the team to identify, diagnose and resolve assembly process related problems by applying problem solving skills.
Manage People and Develop Careers of the Section Team Members
Manage a team of engineers, ensure execute things right
Foster a vibrant, energetic work environment, with a sense of urgency
Provide training and career development for engineers
Build up a creative team, demonstrate technical leadership (Patents, technical paper, global project leaders)
Ensure smooth transition from new process development, 1st qualification success, small volume production launch to high volume manufacturing
Lead a team of Engineers in the development and Qualification of new packaging process, material, equipment and technology solutions to meet NPI requirements and schedule
Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
Closely teamwork with cross function team/site, to ensure successful transfer of NPI to pilot production and High-Volume Manufacturing.
Qualify new process/technology, establish for product NPI and implementation for HVM.
Implement Quality Control Plan, provide proper Documentation for product transfer NPI to manufacturing
Understand the capabilities of the internal sites and work with the Global team on packaging solutions that will be transferable while leveraging advances
Lead the team for best in classyield, sustain and improve yield through continues yield improvement activities and projects.
Provide guidance to team for defect elimination and continuous improvement.
Lead the team for best in classcost, to identify cost reduction opportunity projects, value engineering for low cost process/material, improve cost of scrap through yield improvement.
Technical leadership and lead the team understand the future trend, technology and capabilities required for future packaging solutions, work with Internal teams to put in place new capabilities to enhance process performance.
Provide packaging solutions on time to meet company and customer needs
Define, develop and establish process capabilities, strategy and roadmap
Develop a strategy to develop new capabilities or to overcome the identified process constraints, ahead product requirements.
Work with Internal teams to put in place new capabilities to meet timelines
Work with suppliers on new packaging technology / material / capability / equipment requirement
Work with Equipment/Material counterparts on new equipment/material benchmarking
PhD/Masters/Bachelor’s Degree in Mechanical, Electrical & Electronic or Material Engineering or Equivalent Work Experience Required
5+ years’ leadership experience in semiconductor industry, on process/package development.
Experience in backend engineering process, assembly package technology developmentand technical knowledge with die and wafer level process technology
An understanding of Micron’s silicon and how it interacts at a package level through CPI is a plus
Strong leadership and managements skill in motivating teams and fostering teamwork through clear and open communication
Strong project management skills to ensure execution to timelines
Understanding of business needs and customers’ requirement
Ability to cooperate with people of different levels inside/ outside the company
Self-motivated, self-directed and high passion.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our
Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-MP3 ||Tier 5||