Principal / Senior / Mechanical Simulation Engineer

Principal / Senior / Mechanical Simulation Engineer

Micron Semiconductor Asia Operations Pte. Ltd
Penang Malaysia
Not Specified
Not Specified

Job Description

Req Id: 245281
Job Description:
As a Mechanical Simulation Engineer at Micron Technology, Inc. you will work in PDE Design team on thermo-mechanical simulations for semiconductor packaging and PCB product (module/SSD) development. In this position, you will be responsible for influencing package and PCB designs to prevent mechanical defects, reliability failures, improve the mechanical performance, and advance technology. The scope is to address all mechanical aspects of packaging and PCB assembly technology and associated material and process interactions. Focus will be on solutions to meet increased demands for various form factors with constrained physical and thermal environments. Candidate will be responsible for the modeling and characterization of mechanical responses of the IC package and/or PCB assembly using analysis and measurement techniques. This position will interface with package design, module design, product engineering, hardware, assembly technology development, QA, and other process module teams. Lab work may be required.
  • Solid knowledge through academic coursework or experience required in thermo-mechanical modeling and measurements of semiconductor packaging and/or PCB assemblies.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material properties and material property test methods.
  • Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscoelastic behavior, etc.).
  • Working knowledge in applying Finite Element Modeling (FEM) and/or Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as ANSYS, FloTHERM, and IcePak.
  • A good understanding of semiconductor packaging processes and materials and technology and trends such as; PCB design and manufacturing, molding, wire-bonding, die attach, etc.
  • A good understanding of semiconductor package reliability and defects; solder-joint reliability, warpage, etc.
  • Strong oral and written communication skills.
  • Demonstrated strong work ethic.

Degree required:
  • MS or PhD

Academic Discipline(s):
  • Mechanical Engineering, Materials Engineering, Physics, or related discipline

Fresh graduates are welcome to apply
We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-EA1 ||

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