Senior Engineer Process Wire Bond

Senior Engineer Process Wire Bond

Infineon Technologies Private Limited
Melaka Malaysia
1-3 years
Not Specified

Job Description


Job Description :
In your new role you will:
  • Key driver for yield improvement topic for own process.
  • Drive improvement for quality improvement for own process
  • Perform new machine qualification T32 release
  • Perform DDM lot investigation and disposition.
  • Involve in NLOP, NLOZD project

Your ProfileYou are best equipped for this task if you have:
  • Bachelor degree in engineering
  • Knowledge in wire bond process and skill
  • Knowledge in process engineering

Part of your life. Part of tomorrow. We make life easier, safer and greener – with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world – we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources. Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister’s Office as well as 15 corporate awards.

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