KeyASIC Berhad was incorporated in Malaysia in year 2005. In 2006, we were awarded with Multimedia Super Corridor (MSC) Status by Malaysia Digital Economy Corporation (MDEC). We started off with the design of IP, ASIC and SoC. We now have more than 10 SoC’s manufactured in Silterra 0.18um, 0.16um and 0.13um process technologies. In 2009, we were listed on the main board of KLSE. Khazanah and CIMB are our main investors.
Our core competency is the capability to design SoC and ASIC from system specification and architectural level to GDSII. The key differentiator is our expertise in designing high performance, low power consumption and smaller integrated circuits. We are building up to be a leader in IoT.
KeyASIC Berhad focuses on improving lives by providing IoT-enabling technology in the area of healthcare, wellness applications, consumer electronics, industrial equipment and many other applications. Leverage on KeyASIC’s integrated microcontrollers and wireless connectivity for continual technology improvement.
In addition to the current products, we have the ability of Artificial Intelligence (AI) chip technology and that can be applied to the healthcare, surveillance among other industries. KeyASIC will continue to invest in research and development of products based on IoT, Block Chain and Artificial Intelligence.
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure and quality defects
(SMT) process engineer generally assists in the production line of surface mount technologies, which involve attaching electronic materials to printed circuit boards. Finished products will be inspected by an engineer to assess their quality.
An engineering position that required a personnel with qualification in Electronic Engineering and have sound knowledge in Surface Mounting Technology(SMT) and Printed Circuit Board Assembly (PCBA) environment.
PCBA is the process of connecting the electronic components with the wirings of printed circuit boards. The conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.
The section head is responsible for internal and external management, specialist and organizational tasks in their own section, integrate within the strategic development of the department and the division. They are authorized to issue instructions.
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