Sr Manager, Package Development Engineering

Sr Manager, Package Development Engineering

Micron Semiconductor Asia Operations Pte. Ltd
Penang Malaysia
3-6 years
Not Specified

Job Description


Micron’s vision is to transform how the world uses information to enrich life for all.​Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
Req. ID: 247042
As PDE Package Development Engineering Manager in Network Engineering Team, you will be responsible for development / support of highly automated and computerized Backend equipment (Assembly). You will lead and/or participate in teams to support, improve, provide innovative solution and recommendation to enhance performance, capabilities and features to meet production and new product requirements. You will be involved in equipment, process, standardization, design and develop of automation solution. You will participate in teams to support site integration / new site development efforts and support global alignment activities.
This position requires interfacing with PDE, Sites, Technology Development, Business Unit, Capacity Planning and Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issues forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with Sites, R&D, Procurement, BE Strategic Planning, Quality Engineering, Business Units, other Central departments, and external suppliers to accomplish your objectives.
Responsibilities:
  • Lead, mentor, grow, motivatea team of SME to be able to support the network needs for multiplediscipline not limited to Process & Equipment Development, Program Management, Advance Process Control/iIOT, Data Analytics, Central Equipment Group. Process Control System Group
  • Collaborate within Package Development Team, Product Integration, Design, NPI,IT, Smart Manufacturing, Process Control, Equipment team to develop integrated monitoring tools to manage device yield and other critical care-about during development stage.
  • Manage key partners and incorporate feedback for continual improvement of program and management
  • Collaborate with site teams & fan out globally to drive, develop, and implement improvements in equipment
  • Communicate with suppliers, peers, and customers (business units and manufacturing sites) to accurately relay technical information.
  • Maintain a strong and open relationship with peer group and engineers in other functional areas and in partner organizations.
  • Actively share information with others to raise level of awareness and knowledge.
  • Manage the development lifecycle to ensure the delivery of solutions that are optimized for performance and built to scale
  • Implement solutions that are built for supportability through a well-designed architecture, data model, and lifecycle
  • Manage conflict and drive issues to resolution
  • Provide recognition and inspire team members toward higher levels of commitment and influence

Requirements:
  • Master’s / Bachelor’s degree in a relevant Engineering discipline with an inclination towards software technology.
  • 3+ years’ experience in B/E operations or related manufacturing environment.
  • 3+ years experience in Assembly, SMT is required
  • Leadership experience within the organization
  • Excellent problem solving and analytical skills.
  • Excellent verbal and written communications skills.
  • Excellent Project management skills.
  • Highly result driven individual, self-motivated and ability to multi-task and manage dynamic priorities.
  • Good interpersonal and communication skill and a good team player.
  • Ability to participate in a cross-functional team environment.
  • Experience in semiconductor manufacturing and packaging is an advantage.
  • Occasional travel may be required.

GJS: M2
Hiring Manager: Chris Sim
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions. Through our global brands – Micron® and Crucial® – our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint™ memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our
Keywords: Penang || Pulau Pinang (MY-07) || Malaysia (MY) || Backend Manufacturing || Experienced || Regular || Engineering || #LI-MP3 ||Tier 5||

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