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Packaging R&D Engineer

Intel
Kulim Malaysia
Not Specified

Job Description Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Re

Skills :

Packaging R&D Engineer

Intel
Kulim Malaysia
Not Specified

Job Description Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. * Re

Skills :

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