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Job Description * Technician for Die preparation equipment * Knowledgeable in the Taping, Back Grinding, Wafer Dicing, Die Separator, laser cut and AOI equipment. * Able to hands on and provide systematic problem analysis. * Ability to tr

Job Description * Technician for Die preparation equipment * Knowledgeable in the Taping, Back Grinding, Wafer Dicing, Die Separator, laser cut and AOI equipment. * Able to hands on and provide systematic problem analysis. * Ability to tr

Technician 2, Manufacturing Equipment

Western Digital
Perai Malaysia
Not Specified

Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: . Responsible to sustain (Troubleshoot & Repair) Solder Ball Attach, Reflow Oven, C-Sun Oven, Ultrasonic Cleaning, High Pressure Cleaning, Package Saw, Laser Mark uptime above the targeted goal

Job Description * Technician for Die preparation equipment * Knowledgeable in the Taping, Back Grinding, Wafer Dicing, Die Separator, laser cut and AOI equipment. * Able to hands on and provide systematic problem analysis. * Ability to tr

Technician 3, Manufacturing Equipment

Western Digital
Perai Malaysia
3-6 years

Job Description * Support production and qualification run by maintaining process at optimum performance * Able to use computer and familiar with MS Office - Words/Excel/PowerPoint. * Able to read, write and converse in English and Bahasa Ma

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