Modify Search

Package Failure Analysis Engineer Jobs

Filter
11 Jobs

iVE Patch Validation Technical Lead

Intel
Penang Malaysia
10-13 years

Job Description : Job Description Job Description: This is a staff engineering technical lead position which is part of Intel Validation Engineering (iVE) organisation within the premier research and development group under Malaysia Design Centre (

Skills :

Job Description . Wire Bond process development Engineer * Support New Wire Bond recipe for new wafer technology by delivering assigned Process and Equipment solutions meeting quality, UPH, and development project targets and timelines . New p

What you do at AMD changes everything At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies - building blocks

Skills :

Senior Engineer, Test Engineering

Western Digital
Malaysia
4-7 years

Job Description -Be responsible for packaged flash memory test program development, failure analysis and device debug-Manages production support engineering for a specific product or group of products after transfer from design to high volume produ

Package Failure Analysis Engineer

Intel
Penang Malaysia
Not Specified

Job Description Responsible for identifying and researching component failures to improve product yield, quality and/or reliability. Evaluates the electrical and mechanical characteristics of integrated circuits, components, subcomponents, and system

Skills :

Industry: Manufacturing Location: Penang Headcount: 1 Title: Staff/Principal Structural Simulation Engineer, Packaging Engineer Tenure: Perm Job Description As a packaging structural simulation engineer, you will work in the global Packaging R&D gr

Senior Engineer, Test Engineering

Western Digital
Malaysia
4-7 years

Job Description -Be responsible for packaged flash memory test program development, failure analysis and device debug-Manages production support engineering for a specific product or group of products after transfer from design to high volume produ

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help

Skills :

Package Reliability Engineer (Fresh graduate only)

Micron
Penang Malaysia
2-5 years

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help

Industry: Manufacturing Location: Batu Kawan, Penang Headcount: 1 Title: Senior / Staff Engineer, WireBond Process Engineer Tenure: Perm RESPONSIBILITIES: Job Summary .Wire Bond process development Engineer * Support New Wire Bond recipe for new w

Engineer, Test Engineering

Western Digital
Malaysia
4-7 years

Job Description * Be responsible for packaged flash memory test program development, failure analysis and device debug-Manages production support engineering for a specific product or group of products after transfer from design to high volume pro

Know more