Job Description :
Assembly Process Engineer – Post Encapsulation
As a Post Encapsulating (Laser Mark/Solder Ball Placement) Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product qu
Job Description :
Job Description
Working on real manufacturing data, perform data analysis to gain insight of the manufacturing process and develop model to predict the outcome of the process. Internship duration is between 8 weeks to 8 months.
Qu
Job Description :
In your new role you will:
* Perform or guide Process development activities (Process parameters scouting, optimisation, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, qu
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